The MSI PRO B760M-A WIFI is a high-performance Micro-ATX motherboard tailored for professionals and productivity users. Built on the Intel B760 chipset and LGA 1700 socket, it supports 12th and 13th Gen Intel Core processors including Pentium Gold and Celeron models, with compatibility extending to 14th Gen processors in some listings.
Equipped with 4 DDR5 DIMM slots supporting an impressive maximum memory capacity of 256GB and overclocking speeds up to 6800+ MHz (OC), this motherboard ensures unmatched memory performance. The advanced power delivery system featuring a 12+1 Duet Rail design combined with extended VRM heatsinks and 7W/mK MOSFET thermal pads guarantees stable and efficient CPU power management during intense workloads.
For expansion and storage, it offers 2 reinforced PCIe x16 slots (primary slot with Steel Armor for durability), 2 PCIe Gen4 x4 M.2 slots enabling ultra-fast NVMe SSDs, and 4 SATA 6Gb/s ports. Networking options include onboard Wi-Fi 6E, Bluetooth 5.3 via an Intel module, and Realtek 2.5GbE LAN for fast and reliable connections.
Display outputs include 2 HDMI 2.1 and 2 DisplayPort 1.4 ports supporting 4K60 resolution, contingent on compatible CPU integrated graphics. USB connectivity is comprehensive, featuring multiple USB 3.2 Gen2 ports including a front-panel USB Type-C port, along with USB 2.0 ports for legacy devices.
The PCB boasts a premium 6-layer design with 2 oz thick copper for superior heat dissipation and durability, making the MSI PRO B760M-A WIFI an excellent choice for building reliable, future-proof business and workstation PCs.
Key Features:
- Intel B760 chipset with LGA 1700 socket supporting 12th/13th Gen Intel processors
- DDR5 memory support up to 256GB and 6800+ MHz (OC) with 4 DIMM slots
- Integrated Wi-Fi 6E, Bluetooth 5.3, and 2.5GbE LAN for advanced connectivity
- Dual PCIe x16 slots with Steel Armor reinforcement and a PCIe x1 slot
- Dual Gen4 x4 M.2 slots and 4 SATA 6Gb/s ports for versatile storage options
- Multiple USB 3.2 Gen2 Type A and Type C ports plus USB 2.0 support
- Enhanced thermal design with extended VRM heatsinks and 6-layer 2 oz copper PCB